TEAM Group T-Force DARK Z GRAY UD-D4 32GBx2 3200
- TEAM Group T-Force DARK Z GRAY UD-D4 32GB *2 3200
- Armor design for perfect protection
- Aluminum alloy heat sink with high performance
- High thermal conductive adhesive
- Supports Intel & AMD motherboards
- Selected high-quality IC
- Supports XMP2.0
- Energy saving with ultra-low working voltage
- Taiwan Utility PATENT (number:M585419)
- Chinese Utility PATENT (number: CN 210038691 U)
Description
TEAM Group T-Force DARK Z GRAY UD-D4 32GBx2 3200
| Module Type | 288 Pin Unbuffered DIMM Non ECC | ||||||
| Frequency | 2666 | 2666 | 3000 | 3200 | 3200 | 3600 | |
| Latency | CL15-17-17-35 | CL16-18-18-38 | CL16-18-18-38 | CL16-18-18-38 | CL16-20-20-40 | CL18-22-22-42 | |
| Capacity | 8GB 16GB 8GBx2 16GBx2 |
8GB 16GB 8GBx2 16GBx2 |
8GB 16GB 8GBx2 16GBx2 32GBx2 |
8GB 16GB 32GB 8GBx2 16GBx2 32GBx2 |
8GB 16GB 32GB 8GBx2 16GBx2 32GBx2 |
8GBx2 16GBx2 32GBx2 |
|
| Data Transfer Bandwidth | 21,328 MB/s (PC4 21300) |
21,328 MB/s (PC4 21300) |
24,000 MB/s (PC4 24000) |
25,600 MB/s (PC4 25600) |
25,600 MB/s (PC4 25600) |
28,800 MB/s (PC4 28800) |
|
| Voltage | 1.2V | 1.2V | 1.35V | 1.35V | 1.35V | 1.35V | |
| Dimensions | 43.5(H) x 141(L) x 8.3(W)mm | ||||||
| Heat Spreader | Aluminum heat spreader | ||||||
Armor design, Metal logo
The design based on the concept of an armored knight and a sacred war robe offers more complete protection by refining the heat sink made by the traditional punch press process. Electrolytic anodizing process and metal electroforming logo design are used to echo with the tech armor.
Reinforced structure, Enhanced heat dissipation
It is made by punch press process with a 0.8mm thick, one-piece alloy aluminum. In addition, coloring with the electrolytic anodizing process can offer corrosion resistance and make it non-conductive. By transferring the heat from superconductive thermal adhesive to alloy cooing modules through heat conduction, the overclocking memory can be maintained within operating temperature.
Selected IC chips, Stable and durable
Every IC chip made for TEAMGROUP’s T-FORCE DARK Z DDR4 gaming memory is selected through a rigorous testing process. Every overclocking memory is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility.
High performance, Low power consumption, Easy upgrade
In addition to the increase in data transfer rate, the basic working voltage of the new generation of upgraded DDR4 memory is also decreased to 1.2V. This desktop memory is energy saving, high performance and low power consumption.
Supports Intel XMP, Auto overclocking
T-FORCE DARK Z DDR4 gaming memory is plug and play ready. Overclocking can be super easy without the hassle of manually adjusting the BIOS. It is compatible to both Intel & AMD platform, therefore gamers can build their system without worries.
TEAM Group T-Force DARK Z GRAY UD-D4 32GBx2 3200 Features. Armor design for perfect protection; Aluminum alloy heat sink with high performance Buy-UAE,Oman, Kuwait click link for more details
